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Working closely with technology partners, we develop leading-edge products aligned with market standards and emerging technology. We also provide both off-the-shelf products and deliver customized products for the Enterprise, Cloud, and Communication markets. Through our comprehensive engineering services, we help reduce your design costs and deliver your products to the market faster.

ID/Mechanical Design

 

Imagining, researching, and developing new products, MiTAC has a professional and experienced engineering team which actively invests in software and hardware tools in response to customer requirements and ever demanding technology needs. Using sophisticated design tools, our professional mechanical and thermal engineers provide rugged, high quality designs that meet all of the requirements for operating across wide temperature ranges.

AThermal Design Capability

Our experienced hardware engineers provide high-performance, reliable products built with the most advanced PCB layout and simulation tools, robust design, and a complete validation process. The MiTAC design quality control process ensures seamless transition from New Production Introduction (NPI) to mass production.

Rack Solution Design Capability (Mechanical/Thermal/Packing)

With decades of coding experience, MiTAC firmware & software engineers are profoundly knowledgeable and experienced in developing and customizing BIOS, firmware, drivers, and diagnostics. For example, our Server Management Solutions incorporate the DMTF Redfish® API, Intelligent Platform Management Interfaces, and Rack Scale Design.

 

  • HDI (High Density Interconnect) PCB Design Experiences -- Contains blind and/or buried-via, and often contains micro-via.
  • DFM (Design for Manufacturability) & DFT (Design for Test) Review and Audits -- Addressing manufacturing concerns
  • High Speed Rules-Driven CAD Design -- Embedded high speed constraint rules for PCB layout covering complex physical Design Rule Checking (DRC)
  • In-House CAD Development tools (MUFA) -- for routing quality control and improved efficiency
  • Signal and Power Integrity Analysis -- including Pre and Post layout electrical analysis to reduce design risks
  • Power Transient Simulation
  • DOE (Design of Experiments) SI Methodology -- to predict the worst case margin for high speed channel design
  • Design Building Block Engineering (BBE) and DFMEA (Design Failure Mode and Effects Analysis) Databases -- Schematics Hierarchical design, CPLD code module, PCB stackup and raw material selection guide, and SI test failure RCCA history
  • DFSS (design for six sigma) -- design capability enhancement
Typical Product Development Process
  • A Wide Range of Signal Integrity Test Coverage in the Frequency and Time Domain -- High speed differential and single ended signaling & low speed critical interfaces
  • Power Delivery Modeling -- Using a SIMPLIS simulator for accurate VR design of complex power delivery networks, including critical component selection, tolerance analysis & stability enhancement